Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices
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Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices
Suhir, Ephraim
Taylor & Francis Ltd
10/2024
382
Mole
9780367635886
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1. Analytical Modeling. 2. Method of Interfacial Compliance. 3. Thermal Stress in Assemblies with Identical Adherends. 4. Inelastic Strains. 5. Elevated Stand-Off Heights Can Relieve Thermal Stress in Solder Joints. 6. Stress Relief in Assemblies with Inhomogeneous Bonds. 7. Relieving Thermal Stress in Flip-Chip Design. 8. Board Level Dynamic Tests. 9. Accelerated Testing: HALT and FOAT. 10. Probabilistic Design for Reliability of Solder Joint Interconnections. 11. Thermal Stress in Optical Fibers
Este título pertence ao(s) assunto(s) indicados(s). Para ver outros títulos clique no assunto desejado.
Lead Free Solder;HALT;Maximum Interfacial Shearing Stress;IC Devices;Interfacial Shearing Stress;finite-element analyses;Interfacial Compliance;solder joint interconnections;Solder Joint;inelastic strains;Solder Material;FEA Data;Shearing Stress Functions;Mid-cross Sections;Bonding Layer;Estimated Yield Stress;Drop Test Conditions;Assembly Ends;Bonding Material;Peeling Stress;ASME Journal;Stiff Assemblies;Maximum Shearing Stress;FEA Modeling;Assembly Components;Axial Compliance;CGA;Peripheral Portion;Palmgren Miner Rule;Assembly Size
1. Analytical Modeling. 2. Method of Interfacial Compliance. 3. Thermal Stress in Assemblies with Identical Adherends. 4. Inelastic Strains. 5. Elevated Stand-Off Heights Can Relieve Thermal Stress in Solder Joints. 6. Stress Relief in Assemblies with Inhomogeneous Bonds. 7. Relieving Thermal Stress in Flip-Chip Design. 8. Board Level Dynamic Tests. 9. Accelerated Testing: HALT and FOAT. 10. Probabilistic Design for Reliability of Solder Joint Interconnections. 11. Thermal Stress in Optical Fibers
Este título pertence ao(s) assunto(s) indicados(s). Para ver outros títulos clique no assunto desejado.
Lead Free Solder;HALT;Maximum Interfacial Shearing Stress;IC Devices;Interfacial Shearing Stress;finite-element analyses;Interfacial Compliance;solder joint interconnections;Solder Joint;inelastic strains;Solder Material;FEA Data;Shearing Stress Functions;Mid-cross Sections;Bonding Layer;Estimated Yield Stress;Drop Test Conditions;Assembly Ends;Bonding Material;Peeling Stress;ASME Journal;Stiff Assemblies;Maximum Shearing Stress;FEA Modeling;Assembly Components;Axial Compliance;CGA;Peripheral Portion;Palmgren Miner Rule;Assembly Size
