Nano Interconnects
portes grátis
Nano Interconnects
Device Physics, Modeling and Simulation
Khare, Kavita; Khursheed, Afreen
Taylor & Francis Ltd
10/2024
216
Mole
9780367611156
Pré-lançamento - envio 15 a 20 dias após a sua edição
Descrição não disponível.
Contents
List of Figures ..........................................................................................................ix
List of Tables..........................................................................................................xiii
Preface....................................................................................................................xvii
Acknowledgments...................................................................................................xix
About the Authors ..................................................................................................xxi
Chapter 1 Prefatory Concepts and More .............................................................1
Chapter 2 Interconnect Modeling.......................................................................21
Chapter 3 Repeater Buffer Modeling...............................................................103
Chapter 4 Signal Integrity Analysis.................................................................175
Index......................................................................................................................213
List of Figures ..........................................................................................................ix
List of Tables..........................................................................................................xiii
Preface....................................................................................................................xvii
Acknowledgments...................................................................................................xix
About the Authors ..................................................................................................xxi
Chapter 1 Prefatory Concepts and More .............................................................1
Chapter 2 Interconnect Modeling.......................................................................21
Chapter 3 Repeater Buffer Modeling...............................................................103
Chapter 4 Signal Integrity Analysis.................................................................175
Index......................................................................................................................213
Este título pertence ao(s) assunto(s) indicados(s). Para ver outros títulos clique no assunto desejado.
Interconnect Wire;Interconnect Network Design;Crosstalk Noise;On-Chip Interconnects;CNT Interconnect;Interconnect Modeling;Repeater Insertion;Repeater Buffer Modeling;FDTD Model;Variability Analysis;Victim Net;Signal Integrity;FDTD Technique;SS;Aggressor Net;GNR;Power Consumption;CNT Bundle;Carbon Nanotube Field Effect Transistor;PDP;Dynamic Crosstalk;Cml;DIBL;EDP;Coupling Capacitance;Short Channel Effects;Signal Propagation Delay;Buffer Circuits;FDTD Solution;Leakage Power;Short Circuit Power
Contents
List of Figures ..........................................................................................................ix
List of Tables..........................................................................................................xiii
Preface....................................................................................................................xvii
Acknowledgments...................................................................................................xix
About the Authors ..................................................................................................xxi
Chapter 1 Prefatory Concepts and More .............................................................1
Chapter 2 Interconnect Modeling.......................................................................21
Chapter 3 Repeater Buffer Modeling...............................................................103
Chapter 4 Signal Integrity Analysis.................................................................175
Index......................................................................................................................213
List of Figures ..........................................................................................................ix
List of Tables..........................................................................................................xiii
Preface....................................................................................................................xvii
Acknowledgments...................................................................................................xix
About the Authors ..................................................................................................xxi
Chapter 1 Prefatory Concepts and More .............................................................1
Chapter 2 Interconnect Modeling.......................................................................21
Chapter 3 Repeater Buffer Modeling...............................................................103
Chapter 4 Signal Integrity Analysis.................................................................175
Index......................................................................................................................213
Este título pertence ao(s) assunto(s) indicados(s). Para ver outros títulos clique no assunto desejado.
Interconnect Wire;Interconnect Network Design;Crosstalk Noise;On-Chip Interconnects;CNT Interconnect;Interconnect Modeling;Repeater Insertion;Repeater Buffer Modeling;FDTD Model;Variability Analysis;Victim Net;Signal Integrity;FDTD Technique;SS;Aggressor Net;GNR;Power Consumption;CNT Bundle;Carbon Nanotube Field Effect Transistor;PDP;Dynamic Crosstalk;Cml;DIBL;EDP;Coupling Capacitance;Short Channel Effects;Signal Propagation Delay;Buffer Circuits;FDTD Solution;Leakage Power;Short Circuit Power
