Electronics Production Defects and Analysis
portes grátis
Electronics Production Defects and Analysis
Gopalan, Padma Padmanabhan; Kuttiyil Thomas, Oommen Tharakan
Springer Verlag, Singapore
04/2022
140
Dura
Inglês
9789811698231
15 a 20 dias
448
Descrição não disponível.
Chapter 1: Introduction.- Chapter 2: Soldering Defects.- Chapter 3: PCB Defects.- Chapter 4: Mounting Defects.- Chapter 5: Conformal Coating and Potting Defects.- Chapter 6: EEE Component Defects.- Chapter 7: Workmanship Defects.- Chapter 8: Defects due to the usage of Non-FFF Components.- Chapter 9: Defects in CAD Layout.
Este título pertence ao(s) assunto(s) indicados(s). Para ver outros títulos clique no assunto desejado.
High Reliability Electronics;Multiple Touch Up;Overcoat Peeled;Component Overhang;Barrel-Annular Ring;Inadequate Heel;Void at Pad;Nodule Inside PTH;Mask on Pads;Inadequate Lead Forming;Disturbed Relay;End Cap Peel;Stiffener Crack;Copper Exposure in Hooks;Diode-Earth Tag;Protruded Jumper;Zero Clearance;Stiffener-Solder Joint Clearance
Chapter 1: Introduction.- Chapter 2: Soldering Defects.- Chapter 3: PCB Defects.- Chapter 4: Mounting Defects.- Chapter 5: Conformal Coating and Potting Defects.- Chapter 6: EEE Component Defects.- Chapter 7: Workmanship Defects.- Chapter 8: Defects due to the usage of Non-FFF Components.- Chapter 9: Defects in CAD Layout.
Este título pertence ao(s) assunto(s) indicados(s). Para ver outros títulos clique no assunto desejado.
High Reliability Electronics;Multiple Touch Up;Overcoat Peeled;Component Overhang;Barrel-Annular Ring;Inadequate Heel;Void at Pad;Nodule Inside PTH;Mask on Pads;Inadequate Lead Forming;Disturbed Relay;End Cap Peel;Stiffener Crack;Copper Exposure in Hooks;Diode-Earth Tag;Protruded Jumper;Zero Clearance;Stiffener-Solder Joint Clearance
