3D Microelectronic Packaging

1. Introduction to 3D microelectronic packaging.- 2. 3D packaging architecture and assembly process design.- 3. Fundamentals of TSV processing and reliability.- 4. Mechanical properties of TSV.- 5. Atomistic View of TSV Protrusion/Intrusion.- 6. Fundamentals and failures in Die preparation for 3D packaging.- 7. Direct Cu to Cu bonding and other alternative interconnects in 3D packaging.- 8. Emerging hybrid bonding techniques for 3D packaging.- 9. Fundamental of Thermal Compressive Bonding process, advanced epoxy, and flux materials in 3D packaging.- 10. Fundamentals of solder alloys in 3D packaging.- 11. Fundamentals of electro migration in interconnects of 3D packages.- 12. Fundamentals of heat dissipation in 3D packaging.- 13. Fundamentals of advanced materials and process in substrate technology.- 14. New substrate technologies for 3D packaging. -15. Thermal mechanical and moisture modeling in 3D packaging.- 16. Stress and Strain measurements in 3D packaging.- 17.Processing and Reliability of Solder Interconnections in Stacked Packaging.- 18. Interconnect Quality and Reliability of 3D Packaging.- 19. Fundamentals of automotive reliability of 3D packages.- 20. Fault isolation and failure analysis of 3D packaging.

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• Circuitos e componentes
• Engenharia electrónica
• Dispositivos e materiais electrónicos
• Ciência dos materiais

3D microelectronic packages;Advanced materials in 3D packages;Failure analysis microelectronic packaging;Heat dissipation;Metallic and polymeric packaging materials;Micro bumps;Quality and Reliability of 3D Packaging;Solder connects in 3D packages;TSV Processing and Reliability;Through-silicon via